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Cirlex® polyimide sheet

CIRLEX® Product Description

CIRLEX® has been developed by DuPont to provide industry with a wider variety of thicknesses of polyimide sheet, above the availability of Kapton® film. CIRLEX® has the same excellent balance of physical, chemical, and electrical properties over a wide temperature range as inherent in Kapton® films.

CIRLEX® is offered in thicknesses from 0.015mm (0.006”) to 4.0mm (0.157”).
Thicker constructions are possible.

Cirlex Component Parts

CIRLEX® can be modified by laser cutting, drilling, machining, stamping, shearing and chemical etching to very exact tolerances.

Applications

  • PCB stencils
  • Loudspeaker components
  • Metal clad, thick polyimide materials
  • Slot insulation
  • High-density electronic connectors
  • High-temperature mechanical seals

Availability

CIRLEX® is available in standard sheet.
Stock sizes are nominal 600mm x 600mm or 300mm x 300mm.
Katco will also provide sheet cut to customers' preferred dimensions

CIRLEX® stock thicknesses available from Katco

Sheet size 600mm x 600mm
  mm inches mm inches
  0.15 0.006 0.61 0.024
  0.18 0.007 0.74 0.029
  0.20 0.008 0.99 0.039
  0.23 0.009 1.50 0.059
  0.25 0.010 2.01 0.079
  0.30 0.012 2.51 0.099
  0.36 0.014 2.97 0.117
  0.41 0.016 3.99 0.157
  0.51 0.020 5.00 0.197

 


Typical Properties of CIRLEX® at 23°C and 200°C
    0.010"
0.23mm		 0.012"
0.30mm		 0.015"
0.38mm		 0.030"
0.76mm		 0.050"
1.27mm
Yield Point at 3% Elong. (PSI) 23°C
200°C		 6112
5490		 6500
EL*		 7836
EL		 7097
EL		 6113
EL
Stress at 5% Elong. (PSI) 23°C
200°C		 10360
8339		 10800
EL		 11230
EL		 10370
EL		 9413
EL
Tensile (PSI) 23°C
200°C		 32490
32490		 34000
EL		 11230
EL		 10370
EL		 9413
EL
Elongation (%) 23°C
200°C		 65
85		 64
EL		 63
EL		 57
EL		 56
EL
Modulus (KPSI) 23°C
200°C		 330
239		 332
EL		 334
EL		 274
EL		 264
EL
Density (G/cc or G/ml) 1.42 1.42 1.42 1.42 1.42
Specific Heat (J/g K) 1.09 1.09 1.09 1.09 1.09
CTE (ppm/°C) 20 PPM 20 PPM 20 PPM 20 PPM 20 PPM
Tg (°C) ~351°C ~351°C ~351°C ~351°C ~351°C
Dimensional Stability 250°C MD
XD		 0.13
0.07		 0.09
0.07		 0.07
0.07		 0.27
0.27		 0.20
0.40
Dielectric Strength V/mil 2790 2000 1940 1270 Arc Over
Dielectric Constant KHz 25°C
D		 3.45 3.55 3.58 3.74 3.72
Dissipation Factor 0.0021 0.0020 0.0018 0.0023 0.0026
Moisture Absorption % Max 4 4 4 4 4
Thermal Conductivity W/m K 0.17 0.17 0.17 0.17 0.17
UL Rating   UL 96VO UL 96VO UL 96VO UL 96VO UL 96VO

* EL - material exceed test limits of equipment
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